According to NVTS, TSMC has recently reduced its resources in mature processes and intends to withdraw from the gallium nitride (GaN) market in order to focus on high growth markets. It is reported that TSMC plans to cease production of GaN chips in July 2027 and switch to advanced packaging. The company has reached a follow-up production agreement with PSMC.

Today, Nanomicro Semiconductor announced that it will establish a strategic partnership with Power Semiconductor (PSMC or Powerchip) to officially launch and continue to promote the industry-leading 8-inch silicon-based gallium nitride technology production.

TSMC has advanced 180nm CMOS process capabilities, utilizing smaller and more advanced process nodes to achieve comprehensive optimization in performance, energy efficiency, integration, and cost. TSMC will produce a portfolio of gallium nitride products ranging from 100V to 650V for nano and micro semiconductors to meet the growing demand for gallium nitride in 48V infrastructure, including ultra large scale AI data centers and electric vehicles. The first batch of devices is expected to complete certification in the fourth quarter of 2025. Among them, the 100V series is planned to be first put into production at TSMC in the first half of 2026, while the 650V devices will gradually be transferred from TSMC, the existing supplier of Nano Micro, to TSMC for outsourcing in the next 12-24 months.

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